Special Collection: Electronic Electroplating and Chips
Review
Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects
Yue-Hui Zhai, Yi-Xiao Peng, Yan Hong, Yuan-Ming Chen, Guo-Yun Zhou, Wei He, Peng-Ju Wang, Xian-Ming Chen, and Chong Wang
Communication
Micropatterning and Functionalization of Single Layer Graphene: Tuning Its Electron Transport Properties
Miao-Miao Cui, Lian-Huan Han, Lan-Ping Zeng, Jia-Yao Guo, Wei-Ying Song, Chuan Liu, Yuan-Fei Wu, Shi-Yi Luo, Yun-Hua Liu, and Dong-Ping Zhan
Articles
Effect of Saccharin on Crystallization Behavior of Electroless Cobalt Plating
Yu-Xin Luo, Jing-Jing Wang, Lu Wang, Zi-Yi Yan, Yi Ma, Xin Bo, Jing-Shuang Dang, and Zeng-Lin Wang
Pulse Electroplating of Nanotwinned Copper Using MPS-PEG Two-Additive System for Damascene via Filling Process
Yu-Xi Wang, Li-Yin Gao, Yong-Qiang Wan, Zhe Li, and Zhi-Quan Liu
