Special Collection: Electronic Electroplating and Chips
Reviews
Development Status of Copper Electroplating Filling Technology in Through Glass Via for 3D Interconnections
Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, and Ming Li
Research Progresses of Cobalt Interconnect and Superfilling by Electroplating in Chips
Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, and Su Wang
Electrodeposition of Functional Epitaxial Films for Electronics
Kui Huang, Rong-Jiao Huang, Su-Qin Liu, and Zhen He
Research Progress in Electroless Cobalt Plating and the Bottom-up Filling of Electroless Plating
Yu Shen, Bing-Bing Li, Yi Ma, and Zeng-Lin Wang
Research Progress of Copper Electrodeposition Filling Mechanism in Silicon Vias
Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, and Gui-Fu Ding
Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects
Yue-Hui Zhai, Yi-Xiao Peng, Yan Hong, Yuan-Ming Chen, Guo-Yun Zhou, Wei He, Peng-Ju Wang, Xian-Ming Chen, and Chong Wang
Communications
Micropatterning and Functionalization of Single Layer Graphene: Tuning Its Electron Transport Properties
Miao-Miao Cui, Lian-Huan Han, Lan-Ping Zeng, Jia-Yao Guo, Wei-Ying Song, Chuan Liu, Yuan-Fei Wu, Shi-Yi Luo, Yun-Hua Liu, and Dong-Ping Zhan
Articles
Effect of Chloride Ion on Electrochemical Behavior of Silver Electrodeposition in ChCl-Urea Low Eutectic Solvent
Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, and Jie Sun
Biofouling Behaviors of Pure Titanium Surface Polarized at Different Potentials
Zhao-Xia Dai, Da-Jiang Zheng, Guang-Ling Song, Dan-Qing Feng, and Pei Su
Influences of Suppressing Additive Malachite Green on Superconformal Cobalt filling and Nucleation
Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, and Mao-Zhong An
Application of Numerical Simulation Method in Periodic Pulse Reverse Electroplating Through Hole
Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, and Jin-Qiu Zhang
Effect of Sodium Alcohol Thiyl Propane Sulfonate on Electrolysis of High Performance Copper Foil for Lithium Ion Batteries
Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, and Zhi-Dong Chen
Optimization of Pulse Plating Additives and Plating Parameters for High Aspect Ratio Through Holes
Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, and Zeng-Kun Wu
An Investigation on the Interface Corrosion Behaviors of Cobalt Interconnects in Chemical Mechanical Polishing Slurry
Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, and Tao Hang
Electrochemical SERS study of Benzotriazole and 3-mercapto-1-propanesulfonate in Acidic Solution on Copper Electrode
Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, and Zhi-Dong Chen
Study on Low Voltage Electrodeposition of Diamond-like Carbon Film
Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, and Zhi-Dong Chen
Mechanism and Application of Nickel Nano-Cone by Electrodeposition on a Flexible Substrate
Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, and Yong-Jie Du
Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution
Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, and Yuan-Ming Chen
Electrodeposition Mechanism and Process of a Novel Cyanide-Free Gold Sulfite Bath
Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, and Zhong-Qun Tian
Electrochemical Deposition of Copper Pillar Bumps with High Uniformity
Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, and Ji-Ye Luo
Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler
Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, and Yuan-Ming Chen
Pulse Electroplating of Nanotwinned Copper Using MPS-PEG Two-Additive System for Damascene via Filling Process
Yu-Xi Wang, Li-Yin Gao, Yong-Qiang Wan, Zhe Li, and Zhi-Quan Liu
